PCB Fabrication Process

Each PCB project reaching our board fabrication plant is unique and therefore distinct from one another. As such, we approach every single project that passes through our in-house process with the same utmost attention to detail, be it a simple 2-layer or a highly complex HDI PCB designed for use in aerospace, defense, telecommunications, medical technology, electronics, or other high-tech industries.

With every step of the process done in-house at our new facility in Chungli Industrial Park and handled by our contingent of well experienced engineers, customers are ensured of swiftest response, best processing techniques and solutions, quickest turnaround times, highest quality results and most reliable service they can get for their single piece or small batch PCB/IC substrate orders.

Typical Multilayer Process Flow Chart

  1. Material Shearing
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  3. Inner Layer Imaging
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  5. Inner Layer Etching
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  7. Inner Layer Inspection
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  9. Oxidation
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  11. Layer
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  13. Lamination
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  15. Drilling
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  17. Panel Plating
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  19. Outer Layer Imaging
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  21. Pattern Plating
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  23. Outer Layer Etching
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  25. Solder Mask Coating
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  27. Surface Treatment
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  29. Legend Printing
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  31. Routing
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  33. Electrical Testing
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  35. Final Visual Inspection
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  37. Dimensional Checking
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  39. Shipping

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