Maintaining 2-3 work shifts to ensure every piece of PCB/IC substrate ordered is completed on time and as specified.
Backed by a pool of talented front-end and CAM engineers to provide the best solutions for HDI or IC packaging projects.
With complete in-house production facility, including fully automated InCAM system, AOI and other advanced equipment.
Operating round the clock to meet every single or multilayer board prototype required by the customer.
Faster turnover rates offers the best alternative for electronic design or manufacturing service companies working on tight deadlines.
