The Latest updated technologies and materials for 5G communication device,aviation and military

UL registered

  • File number#E199875 Rigid-Flex with HDI PCB Manufacturer
  • File number#E484516 HDI Blind and Buried Microvias


ROGERS RO3003 RO3010 RO4350 RO4850 PCB Manufacturer


Quick Turn PCB Manufacturer

Providing fastest production
turnaround solution

Layer count Fastest turnaround time
(no. of working days)
Order size
2-6 2 up to 2000
8-12 3 up to 1500
14-18 4 up to 1000
20-above 5 up to 500

100% HDI-SBU In-house Process

  • 1.The copper surfaces are brown oxied.

  • 2.the laser drill holes created with the method of Direct Laser Drill.

  • 3.The conformal laser drill holes shapes are microsectioned and inspected with microscope (CY-930A).

  • 4.The Brown oxide (0.35-0.45 mil thick) are removed from the copper surfaces.

  • 5.The hydrocrabon residues on captures pads are removed by Plasma desmear.

  • 6.The surfaces of captures pads are examined by LaserVia AOIM(MACHVSION).

  • 7.Chemical desmear Alkaline permanganate cycle and panel plating are succeeded by Plasma Desmear.

  • 8.The laser drill holes at sequential build-up are plated shut by copper plating like 4+N+4 or (ALIVH).

Sitemap Quick Turn PCB Semiconductor Testing Boards