描述 | 標準 | 進階 |
---|---|---|
Min.Trace/Space | 1.5mils / 1.5mils | 1.2mils / 1.5mils |
Min. Copper Thickness | 1/3oz | 1/7 oz |
Max. Copper Thickness | 10oz | 12oz |
Min. Core Thickness | 5mils | 3mils |
Line/ pad to drill hole | 6mils | 4mils |
Line/ pad to board edge | 8mils | 6mils |
Line Tolerance | +/-10% | +/-8% |
描述 | 標準 | 進階 |
---|---|---|
Max. Finish Board Size | 19”X26” | 20”X28” |
min. Finish Board Size | 0.2"x0.2" | 0.15"*0.15" |
Max. Board Thickness | 0.260"(+/-10%) | 0.280"(+/-8%) |
Min. Board Thickness | 0.007"(+/-10%) | 0.005"(+/-10%) |
描述 | 標準 | 進階 |
---|---|---|
Layer Count | 50L | 60L |
Layer to Layer Registration | +/-4mils | +/-2mils |
描述 | 標準 | 進階 |
---|---|---|
Min. Drill Size | 6mils | 5mils |
Min. Hole to Hole Pitch | 16mils(0.45mm) | 14mils(0.35mm) |
True position Tolerance | +/-3mils | +/-2mils |
Slot Diameter Tolerance | +/-3mils | +/-2mils |
Min gap from PTH to track inner layers | 5mils | 4mils |
Min. PTH edge to PTH edge space | 8mils | 6mils |
描述 | 標準 | 進階 |
---|---|---|
Max. Aspect Ratio | 30:1 | 35:1 |
Cu Thickness in Through hole | 0.8-1.5 mils | 2 oz |
Plated hole size tolerance | +/-2mils | +/-1.5mils |
NPTH hole tolerance | +/-2mils | +/-1mils |
Min. Via in pad Fill hole size | 6mils | 4mils |
Via in pad Fill Material | Epoxy resin/Copper paste | Epoxy resin/Copper paste |
描述 | 標準 | 進階 |
---|---|---|
Min. Trace/Space | 2mils / 2mils | 2mils / 2mils |
Min. pad over drill size | 6mils | 4mils |
Max. Copper thickness | 12 oz | 18 oz |
Line/ pad to board edge | 8mils | 6mils |
Line Tolerance | +/-15% | +/-8% |
描述 | 標準 | 進階 |
---|---|---|
HASL | 50-1000u” | 50-1000u” |
HASL+Selective Hard gold | Yes | Yes |
OSP | 8-20u” | 8-20u” |
Selective ENIG+OSP | Yes | Yes |
ENIG(Nickel/Gold) | 80-200u”/2-9 u” | 250u”/ 10u” |
Immersion Silver | 6-18u” | 6-18u” |
Hard Gold for Tab | 10-80u” | 10-80u” |
Immersion Tin | 30u”min. | 30u” min. |
ENEPIG (Ni/Pd/Au) | 125u"/4u"/1u” min. | 150u"/8u"/2u” min. |
Soft Gold (Nickel/ Gold) | 200u”/ 20u”min. | 200u”/ 20u” |
描述 | 標準 | 進階 |
---|---|---|
S/M Thickness | 0.4mils min. | 2mils max. |
Solder dam width | 4mils | 3mils |
S/M registration tolerance | +/-1.5mils | +/-1mils |
S/M over line | 3.5mils | 2mils / 2mils |
描述 | 標準 | 進階 |
---|---|---|
Min. Space to SMD pad | 6mils | 4mils |
Min. Stroke Width | 6mils | 5mils |
Min. Space to Copper pad | 6mils | 4mils |
Standard Color | White or Yellow | N/A |
描述 | 標準 | 進階 |
---|---|---|
Max. Test Points | 30000 Points | 30000 Points |
Smallest SMT Pitch | 16mils(0.45mm) | 12mils(0.3mm) |
Smallest BGA Pitch | 10mils(0.3mm) | 6mils(0.15mm) |
描述 | 標準 | 進階 |
---|---|---|
Min. Rout to copper space | 8mils | 4mils |
Rout tolerance | +/-4mils | +/-3mils |
描述 | 標準 | 進階 |
---|---|---|
Conductor to center line | 15mils | 15mils |
X&Y Position Tolerance | +/-4mils | +/-3mils |
Score Anger | 30º/45º | 30º/45º |
Score Web | 10mils min. | 8mils min. |
描述 | 標準 | 進階 |
---|---|---|
bevel anger | 20-71º | 20-71º |
Bevel Dimensional Tolerance | +/-10mils | +/-10mils |
描述 | 標準 | 進階 |
---|---|---|
Impedance controll | +/-5% | +/-5% |